EFMD Global Fairs

EFMD Global Fairs

2026 Virtual China Career Fair

2026 Virtual China Career Fair

Banking and FinTech Career Forum 2026

Banking and FinTech Career Forum 2026

Career Meet & Greet

Career Meet & Greet
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Latest Job

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Deadline: 30 OCT

2027 HSBC Hong Kong Student Work Placement (January – June)

The Hongkong and Shanghai Banking Corporation Limited

Deadline: 30 OCT

2027 HSBC Hong Kong Student Work Placement - Data Analytics

The Hongkong and Shanghai Banking Corporation Limited

Deadline: 30 OCT

2027 HSBC Hong Kong Student Work Placement - Global Risk, Traded and Treasury Risk and Credit Risk

The Hongkong and Shanghai Banking Corporation Limited

Deadline: 30 OCT

2027 HSBC Hong Kong Student Work Placement - Global Sustainability, Sustainable Finance

The Hongkong and Shanghai Banking Corporation Limited

Deadline: 09 SEP

People & Talent Intern (Sep Intake - Part-time)

Recruit Express (Hong Kong) Limited

 

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